比较A7 CFET和A10 Nanosheet FETs从Parasitics到芯片可靠性( E)TUM, (Chinese (Simplified) ).UNIMORE, (Chinese (Simplified) ).Applied Materials(Chinese (Simplified) ).

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Researchers at the TU Munich, University of Modena and Reggio Emilia, and Applied Materials published a technical paper titled “System-Technology Co-Evaluation of A7 CFET and A10 NSFET Technologies from Cell Parasitics to Chip Reliability.” Abstract Excerpt: “ In this work, we present a physics-based thermal- and aging-aware system-technology co-evaluation (STCO) flow to assess parasitic RCs in A7 CFET and A10 NSFET technology nodes. Our flow links calibrated device models, optimized standard-cell generation, automated GDS-to-TCAD conversion enabling accurate 3D parasitic RC extraction, full RTL-to-GDS implementation for an AI accelerator, multiphysics thermal analysis, and physics-based bias temperature instability (BTI) aging evaluation. Using the same device model for both technologies, we can isolate the impact of parasitic RCs and design at different levels of the design flow. ” Benkhelifa, Mahdi, Leon Mayr, Hadi Nour Eddine, Andrea Padovani, Luca Larcher, and Hussam Amrouch. “System-Technology Co-Evaluation of A7 CFET and A10 NSFET Technologies from Cell Parasitics to Chip Reliability.” arXiv preprint arXiv:2609.15326 (2026).