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Rapidus围绕2nm规划构建设计生态系统Foundry

Rapidus Builds Design Ecosystem Around Planned 2nm Foundry
2026-10-05 19:13 UTC · Source: semiconductor-digest.com
Rapidus Builds Design Ecosystem Around Planned 2nm Foundry
As part of its first phase, Rapidus is announcing the formation of Design Solution Associates to help customers support early-stage design for Rapidus' advanced 2nm semiconductor foundry. The post Rapidus Builds Design Ecosystem Around Planned 2nm Foundry appeared first on Semiconductor Digest .

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Home » Rapidus Builds Design Ecosystem Around Planned 2nm Foundry Rapidus Corporation today announced that it will establish the Rapidus Collaborative Open Rapid Ecosystem (CORE), a global ecosystem framework to support the development and mass production of cutting-edge semiconductors. Today, semiconductor development requires more than just manufacturing technology; it is essential to integrate the entire semiconductor value chain —including research institutions, EDA, IP, design and manufacturing — to provide customers with a development and production infrastructure they can rely on. Further, amid a global shortage of cutting-edge semiconductor talent, it is crucial to build a design ecosystem that enables customers to begin development at an early stage by collaborating with design-related companies. As the first Rapidus CORE initiative, Rapidus is announcing the formation of Design Solution Associates, a group of design companies. Design Solution Associates will serve as a bridge between customers and Rapidus, providing each company’s design resources and specialized expertise to support the rapid evolution of semiconductor development. This will enable Rapidus to strengthen its support system — from design through manufacturing — to meet customer needs both in Japan and overseas. The 17 Design Solution Associates announced today are as follows, in alphabetical order: AION Silicon Limited; Cadence Design Systems, Inc.; Dai Nippon Printing Co., Ltd.; GreatAsic Technology Sdn. Bhd.; HCL Technologies Limited; Infinecs Systems Sdn. Bhd.; Infosys Limited; MavissDesign Co., Ltd.; MosChip Technologies Limited; NSW Inc.; Oppstar Technology Sdn Bhd; Quest Global Services Pte. Ltd.; SkyeChip Berhad; Synopsys, Inc.; TOPPAN Inc.; Toshiba Information Systems (Japan) Corporation and Wipro Limited. Moving forward, Rapidus will expand its CORE offerings beyond design to include EDA, IP and other categories. By strengthening partnerships with companies in each of these categories, Rapidus will help accelerate the global ecosystem that supports the development and mass production of cutting-edge semiconductors. Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

中文摘要

作为第一阶段的一部分,Rapidus正在宣布组建设计解决方案协理公司,以帮助客户支持早期设计Rapidus'高级 2nm 半导体铸造。Rapidus围绕2nm规划构建设计生态系统Foundry首先出现在半导体文摘上。

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