全球Foundry 2.0 收入增加25%YoY在2Q 2026中记录96.6B

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Home » Market News » Global Foundry 2.0 Revenue Up 25% YoY to Record $96.6B in 2Q 2026 The global foundry 2.0 market revenue climbed by 25% year-on-year (YoY) and 11% quarter-on-quarter (QoQ) in 2Q 2026 to reach $96.6 billion, according to Counterpoint Technology Market Research’s latest Foundry Market Supply Tracker. The growth has accelerated compared with the last quarter and was largely driven by the continuous demand for AI GPUs and the expansion of AI infrastructure.This includes custom ASICs, server CPUs , networking chips and power management ICs. “With pure-play foundries, non-memory IDMs and OSATs all posting double-digit growth, the AI investment cycle has broadened across every segment of the value chain. TSMC remains the central beneficiary, but there are more opportunities emerging for mature-node foundries, non-memory-IDM and OSAT vendors,” said Associate Director, Brady Wang. “Advanced packaging is still a major constraint since AI processors have become larger in size and more complex in design.” Counterpoint estimates TSMC’s CoWoS supply-demand gap to remain around 20% in 2026, narrowing to roughly 10% in 2027 as its in-house capacity scales toward 185 KWPM. Longer test times and additional test steps are gradually turning OSAT vendors into strategic second sources in the AI semiconductor ecosystem. 【EAC2026】Keynote: From IC Design to Intelligent Systems: Building the Next Semiconductor Growth Story The whole sector revenue increased by 29% YoY in 2Q 2026 to $54.9 billion, with TSMC’s revenue rising by 34% YoY and 12% QoQ to $40.2 billion, or about 42% of the total Foundry 2.0 market, up from 38% in 2025. Although its YoY growth moderated from 41% in 1Q 2026 due to a higher comparison base, we still see strong sequential momentum and expect it to deliver about 43% revenue growth for full year 2026. This implies 2H 2026 revenue growth of close to 50% YoY, which depends on the N2 ramp, wafer price increases and CoWoS capacity additions landing on schedule. Tight CoWoS capacity limits shipments of AI products, hence TSMC increased backend investment while customers are building alternative packaging options simultaneously. Although this is not going to affect TSMC’s leading position in customers’ advanced products, there’s a structural reallocation of manufacturing capacity in both advanced/mature nodes and packaging. Source: Counterpoint Research Foundry Market Supply Tracker, Q2 2026 Non-TSMC pure play foundry revenue grew 18% YoY, up from 9% YoY in Q1 2026, with SMIC posting strong growth of 36% YoY. SMIC benefited from strong demand for local AI chips, which we expect to keep its N+2 capacity tight throughout 2026, as well as higher utilization, while Hua Hong and Nexchip grew 17% and 21% YoY, respectively. Taiwanese second-tier foundries posted mixed results. UMC/Vanguard grew 9%/20% YoY and 13%/9% QoQ respectively, driven by demand for PMICs, MCUs, and other peripheral chips, which lifted utilization rates. However, mature-node tightness is concentrated in AI-related applications such as PMICs and interposers rather than reflecting an industry-wide shortage, as consumer demand remains soft. While TSMC continues to optimize its capacity by allocating advanced nodes, Vanguard appears to be capturing interposer demand, while UMC is benefiting from improving exposure to PMICs and silicon photonics. GlobalFoundries grew at a more modest pace, as weaker automotive and smartphone demand offset strong growth in its communications infrastructure and data center business, driven by silicon photonics and silicon germanium demand for AI optical networking. “Samsung and Intel Foundry also benefit as customers look for additional sources. Samsung held the No. 2 foundry position with around 4% share in Q2 2026, supported by SF4/SF5 demand and higher wafer prices, while Intel’s EMIB-T packaging has been adopted for Google’s next-generation TPU. But neither supplier currently serves as a perfect alternative to T