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GlobalFoundries, (Chinese (Simplified) ).TSMC执行 2B 交易U.S.AI芯片包装组件
GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
2026-10-08 21:10 UTC · Source: semiconductor-digest.com
Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies. The post GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components appeared first on Semiconductor Digest .
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Home » GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components
GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.
GF expects to expand capacity at its Malta facility and establish the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components. The additional manufacturing capacity will provide greater scale and flexibility for delivering advanced packaging solutions across multiple product generations.
“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems,” said Ed Kaste, senior vice president of CMOS Business at GF. “By providing manufacturing service using GF’s trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain.”
Volume production is expected to begin ramping at GF’s Malta site during the first half of 2028. The agreement has an initial term of five years and provides a framework for future capacity expansion.
Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.
中文摘要
Multi-year 20亿美元的协议将扩大先进包装生态系统的能力,并支持日益增长的需求。AI和高性能计算技术。GlobalFoundries, (Chinese (Simplified) ).TSMC执行 2B 交易U.S.AI芯片包装组件首先出现在半导体文摘上。
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