Teradyne发射UltraFLEXplus S 边缘测试平台AI芯片

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Home » Teradyne Launches UltraFLEXplus S Test Platform for Edge AI Chips Teradyne, Inc . (NASDAQ: TER), a provider of automated test equipment and advanced robotics, today announced the launch of the UltraFLEXplus S series , an extension of its UltraFLEXplus platform engineered to maximize output per square meter and operational efficiency for high-mix, variable-volume semiconductor manufacturing for edge AI applications. The first model, UltraFLEXplus S24, is a 24-slot system built for both engineering and production use, with particular emphasis on the economics that matter most to integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) providers. The single-module UltraFLEXplus S series is positioned alongside the quad-module UltraFLEXplus Q series as part of Teradyne’s scalable UltraFLEXplus platform strategy. As demand grows at the edge, manufacturers face economic constraints, supply chain dynamics, device volumes, and product mixes that differ from those in data center and cloud applications, making cost effectiveness across both capital and operating expenses critical to success. The UltraFLEXplus S delivers an efficient option for these devices built on the same architecture and IG-XL software foundation. “Floor space is one of the biggest hidden costs in high-mix manufacturing, and UltraFLEXplus S is built to optimize it,” said Roy Chorev, vice president and general manager of the Compute Test division at Teradyne. “As AI moves from the data center to the edge, customers need a platform that fits their facilities today and scales with them tomorrow, without giving up the rigor and reliability they already trust from UltraFLEXplus.” With the introduction of UltraFLEXplus S series, Teradyne extends the reach of its proven UltraFLEXplus architecture to tackle emerging edge applications. By leveraging existing test development infrastructure, such as test program libraries, and the IG-XL software environment, UltraFLEXplus S supports Teradyne’s continued investment in helping customers scale test operations while improving engineering efficiency and quality to meet the evolving market demand. Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.