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SEMIFIVE用于开发机器人AI芯片为Mobilint
SEMIFIVE to Develop Robotics AI Chip with Mobilint
2026-10-12 23:19 UTC · Source: eetasia.com
SEMIFIVE and Mobilint will develop a robotics AI chip integrating advanced memory and interconnect technologies for autonomous operation. The post SEMIFIVE to Develop Robotics AI Chip with Mobilint appeared first on EE Times Asia .
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Home » Processors/Controllers » SEMIFIVE to Develop Robotics AI Chip with Mobilint
SEMIFIVE and Mobilint will develop a robotics AI chip integrating advanced memory and interconnect technologies for autonomous operation.
SEMIFIVE has signed a turnkey development contract with South Korean AI semiconductor company Mobilint to develop an AI chip for robotics applications under a South Korean government-funded program.
The project is part of the Ministry of Trade, Industry and Resources’ (MOTIR) K-On-Device AI Semiconductor Technology Development program, which supports collaboration between domestic chip developers and end-user companies to develop and commercialize application-specific semiconductors.
The chip is intended to handle AI computation locally, enabling robots to process vision and sensor data in real time without relying on continuous connectivity to external servers. Target applications include agricultural robots operating outdoors and in areas with limited network coverage.
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SEMIFIVE will handle the project under its “Spec Hand-off” turnkey model. Customers provide performance targets and specifications, while SEMIFIVE manages the development process, including detailed design, packaging, testing and preparation for mass production.
The chip will incorporate LPDDR6 memory, PCIe Gen6 and UCIe-S (Universal Chiplet Interconnect Express – Standard Package). The technologies are intended to support memory bandwidth, high-speed data transfer and chiplet integration within a single package.
The companies expect the project to support the development of South Korea’s domestic AI semiconductor ecosystem and expand the use of locally developed chips in robotics platforms.
“This contract marks a pivotal moment for SEMIFIVE as we extend our proven, end-to-end ASIC capabilities from data center and edge AI into the realm of robotics AI,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “As a leader in custom semiconductors, we will continue to expand our technological footprint and influence across advanced industries.”
中文摘要
SEMIFIVE和Mobilint会开发机器人AI芯片集成高级内存和互联技术进行自主操作。 post SEMIFIVE用于开发机器人AI芯片为Mobilint首次出现于EE时间Asia。 。 。 。
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