Rigaku显示大小写X-Ray Metrology半导体制造SEMICON 2026年西部

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Home » Semiconductor » Rigaku to Showcase X-Ray Metrology for Semiconductor Manufacturing at SEMICON West 2026 Rigaku will demo X-ray metrology tools for wafer characterization, contamination analysis, thin films and advanced packaging at SEMICON West. The Rigaku Group will showcase its semiconductor metrology technologies at SEMICON West 2026, scheduled for October 13–15 at Moscone Center in San Francisco, California. The exhibit will cover applications ranging from surface contamination analysis and crystal characterization to thin-film measurement, process control and advanced packaging. The company’s portfolio includes X-ray techniques for non-destructive inspection and measurement during semiconductor manufacturing. Rigaku’s featured products will include XRTmicron systems for X-ray topography and dislocation imaging, and XTRAIA platforms for thin-film, structural and critical-dimension metrology. The company will also present total-reflection X-ray fluorescence (TXRF) systems for trace surface contamination analysis and wavelength-dispersive X-ray fluorescence (WD-XRF) tools for film thickness and composition measurement. Watch Now: Engineering Grid Stability with High‑Efficiency ESS​ Rigaku said its Technology Center Silicon Valley in Sunnyvale, California, provides U.S. semiconductor customers with access to metrology demonstrations and application support. “SEMICON West is an important gathering for the semiconductor community, and its return to San Francisco allows us to engage directly with customers about the manufacturing challenges they face,” said Richard Brough, Sales Director, Semiconductor. “By organizing our X-ray metrology technologies around applications and workflows, we aim to help customers connect their process challenges with the measurement solutions and insights they need throughout development and production.”