Onsemi用于系统效率的嵌入式动力平台

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Sep 16, 2026 2:30pm Sensors Applications Environmental / Atmospheric Industrial / Manufacturing Energy / Utilities --> The industry trend of embedding various computing functions directly onto silicon, instead of on a separate portion of a printed circuit board or platform or even farther away in a separate box, continues to gain steam. Chip designers want to mash up AI chips, sensors, memory, connectivity and other functions directly into a single silicon chip or wafer, or as close as possible, for greater efficiency. Power integration onto silicon is also another key objective, to reduce complexity of designs and to be ready for AI and the driving need to reduce electricity demands. Onsemi has adopted this thinking with a new Embedded Power Platform, calling it a “breakthrough” in system architecture. The EPP platform delivers “unprecedented power density” along with integration of multiple dies into a single silicon device, the company said in a Wednesday announcement. It does so by bringing electrical, mechanical and thermal designs together, integrated onto a 12-inch silicon wafer. Until now, they have been separate functions. Onsemi released images of its EPP wafer, as well as an EPP chip. for epp story Subaru is an early partner for EPP to evaluate ways it can support future electrified vehicles. Subaru has early access to samples and simulation models. While Onsemi is widely known as a maker of intelligent sensors, it actually gets nearly half of its revenues from power-related solutions, and EPP fits into that category. The company exceeded $6 billion in revenue in 2025. A schematic shows EPP as an interconnection of a series of heterogenous silicon, silicon carbide and gallium nitride dies on a 12-inch silicon substrate. This allows embedded field effect transistors, drivers and controllers to be integrated with power devices for tighter electrical coupling and greater efficiency. Power density can be improved by optimizing electrical, thermal and mechanical systems together. That approach replaces existing architectures where electrical, thermal and mechanical systems are each optimized independently instead of together. Sensors can also be included in the EPP, Onsemi assured me. Sensors such as NTC (negative temperature coefficient) temperature sensors and current sensors are already included in some of the products based on EPP, the company said. Onsemi sees EPP applications in vehicle electrification and AI power infrastructure. For vehicles, there can be smaller and lighter traction inverter systems, and improved thermal performance. For AI power, there can be higher power to free up board and rack space. The company claims up to five times the power density depending on the application. In one early EPP design of a solid-state circuit breaker, the result was half as big and 20% cooler than existing designs. EPP “will redefine how power systems are built and create a new foundation for AI infrastructure, electrification and automation,” said Onsemi CEO Hassane El-Khoury in a statement.