ACCM将新的先进材料和能力提高至2026年PCB西部

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An exploration of the PDN bucket brigade concept. READ MORE... The difference between process capability and design intent. READ MORE... Dynamic flex applications require careful consideration. READ MORE... https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19405-the-charge-of-the-bucket-brigade https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19407-why-don-t-uhdi-capability-charts-tell-the-whole-story https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19406-flex-dfm-guidelines-part-1 https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19401-rf-pcb-layout-transmission-lines-impedance-and-pdn-design https://pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/19404-flexpert-bending-with-attached-structure https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19202-tolerances-and-dimensions-for-pcb-fabrication Advanced Chip & Circuit Materials, Inc. (ACCM) will be in Booth 611 of the 2026 PCB West exhibition on September 30, 2026, to share details on its latest electronic materials, including its high-performance Celeritas® materials. The materials are ideal for a wide range of applications, including artificial intelligence (AI), high-performance computing (HPC), military/aerospace, and chip packaging products operating well into the 100+ GHz and 448 Gb/s ranges. Set for the Santa Clara Convention Center (Santa Clara, CA), PCB West is one of the electronic industry’s best-attended trade shows for customers involved with chip packaging and printed-circuit-board (PCB) materials and assembly. Designers and developers of the latest AI/HPC chip packages and PCBs can achieve increased reliability with outstanding signal integrity (SI) by using various Celeritas materials. To control warpage and minimize generation of heat at high power levels, Celeritas® HM001 and HM50 materials help stabilize heavy copper PCB power and ground planes. Celeritas® SMC (Silicon Matched Core) organic substrate materials can be tuned to match in-plane coefficients of thermal expansion (CTE) of the silicon interposer. Celeritas® SF800 and SF1600 materials’ superior, extremely low-loss, stable-Dk, skew-free performance are well suited for High Speed Digital (HSD) circuits to 112 GHz and beyond. Booth visitors can learn about ACCM (www.adv-ccm.com) capacity and capability to supply advanced materials in high-volume quantities and short lead times, aided by the latest in automated manufacturing lines and knowledgeable personnel. To find out more, come to Booth 611 at the 2026 PCB West and ask for ACCM’s VP of Marketing, Michael Gay, or VP of North America Sales, Rich Pangier. For further information about ACCM and its product lines, please email This email address is being protected from spambots. You need JavaScript enabled to view it. . ISSN 1939-5442, Copyright © 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy