PCB设计工具销售减少15%Q2, (Chinese (Simplified) ).ESD联盟报告

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An exploration of the PDN bucket brigade concept. READ MORE... The difference between process capability and design intent. READ MORE... Dynamic flex applications require careful consideration. READ MORE... https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19405-the-charge-of-the-bucket-brigade https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19407-why-don-t-uhdi-capability-charts-tell-the-whole-story https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19406-flex-dfm-guidelines-part-1 https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19401-rf-pcb-layout-transmission-lines-impedance-and-pdn-design https://pcdandf.com/pcdesign/index.php/current-issue/243-flexperts/19404-flexpert-bending-with-attached-structure https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19202-tolerances-and-dimensions-for-pcb-fabrication MILPITAS, CA — Printed circuit board and multichip module design software revenue dropped 15.4% in the second quarter to $364.2 million, the ESD Alliance announced today. The four-quarter moving average, which compares the most recent four quarters to the prior four, decreased 1.3%. Overall electronic system design (ESD) industry revenue increased 12.2% year-over-year to $5.71 billion. The four-quarter moving average rose 11.2%. “The electronic design automation industry once again reported strong year-over-year revenue growth in Q2 2026,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report and chief executive of Silvaco Group. “All product categories except printed circuit board and multichip module reported gains, with IC physical design and verification, semiconductor IP and services showing double-digit growth. All geographic regions reported growth in Q2, with double-digit increases in the APAC region.” Companies tracked in the EDMD report employed 71,396 people globally in the quarter, down 1.6% from a year ago and down 1.6% sequentially. For the June period, computer-aided engineering (CAE) revenue increased 7.7% to $2.07 billion. The four-quarter CAE moving average increased 10.7%. IC physical design and verification revenue increased 16.6% to $818.3 million. The four-quarter moving average increased 5.4%. Semiconductor intellectual property (SIP) revenue increased 20.4% to $2,199.0 million. The four-quarter SIP moving average rose 16.6%. Services revenue increased 25.1% to $251.7 million. The four-quarter Services moving average rose 15.2%. The Americas, the largest reporting region by revenue, procured $2.44 billion worth of electronic system design products and services, up 7.1% increase. The four-quarter moving average for the Americas rose 8.6%. Asia Pacific (APAC) jumped 22.4% to $2.3 billion. The four-quarter moving average for APAC grew 18.3%. The Europe, Middle East, and Africa (EMEA) market generated $665.6 million in sales, up 2.3% increase. The four-quarter moving average for EMEA grew 8.6%. Japan also increased, up 9.3% to $303.1 million, although its four-quarter moving average decreased 8.2%. ISSN 1939-5442, Copyright © 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved. This website contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy